ViaGaN is a provider of LEDs for lighting, automotive, cellphone and medical applications. ViaGaN’s revolutionary wafer level packaging technology provides a best in class chip scale package with superior thermal, optical and electrical performance at a competitive price. ViaGaN provides solutions based on LED chips from leading manufacturers, and works with its customers to tailor its solutions for their applications. ViaGaN core technology expertise includes optical design and testing, thermal design and process development. ViaGaN’s team has developed leading edge devices and process technology, which being used in consumer electronics products.
About Us
Technology
ViaGaN provides a compact, chip scale packaged LED. The ViaGaN process leverages semiconductor know how and facilities to create a wafer level packaging process flow. The process starts from known good LEDs which are assembled on a patterned Silicon wafer. A glass wafer, phosphor and Silicone are attached to the LED topside, providing high performance light extraction. The Silicon backside is processed to create metal pads for electrical and thermal connections. The wafer is then diced, which results in individual LEDs ready to be assembled on a PCB.
Our Products
VIAGAN WAFER LEVEL PACKAGING PROVIDES
Superior heat
dissipation
Wide light
emission angle
Superior
Light Output
Low forward
voltage
VIA1616S
1.6X1.6X0.8 mm single die chip scale package
VIA1919S
1.9X1.9X0.8 mm single die chip scale package
VIA3535A
3.5X3.5X0.8 mm 2X2 die array chip scale package
Special Solutions For High Flux & Small Area Light Modules
● Flash module
● Automotive Lighting
● Spot lighting
Customized Solutions – Contact Us For Details
Our Team
Dr. MOTI MARGALIT
CEO & FOUNDER
CEO and founder CVT, a thin film transistor company
VP R&D and inventor of novel electronics packaging Tessera (TSRA:NSDQ)
CTO and founder Lambda Crossing, an integrated optics company
PhD, MSc and BSc Technion, 28 US patents.
Dr. ALEX WEI
VP BUSINESS DEVELOPMENT
VP, BD Tessera (TSRA:NSDQ)
VP, S&M, Amkor – Packaging and Testing company
GM, Asia, Midas Vision – a LTCC/HTCC company
President, CHC, SBIP – GaAs microwave telecom company
BSEE, CCIT; MBA, NTUST; Ph.D., NCTU
